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About the product
Characteristic
China
300
DM-200-BU
Paste
180℃
Repair soldering paste for SMD such as PCB,BGA and PGA
DM-200-BU
99
Flux paste
None
0.001
Welding spot peripheral
Neutral
No
No
DM-200-BU
Description
Burnley助焊膏适用于手机PCB,BGA及PGA等SMD之返修助焊膏,它使用于低离子性之活化剂系统,润锡速度快,冒烟程度很低,残留物固化后之表面绝缘阻抗值很高,因此,对手机等通讯产品之电性干扰非常小 DM-200为中度活性之松香型助焊膏,广泛使用手机板之SMD返修工艺
适合南北桥,显卡,手机芯片,电玩BGA芯片焊接,植球,也可做脱锡使用,效果非常理想,残留物少、焊点亮、烟雾少、无刺激气味、不跑球
Characters
China
300
DM-200-BU
Paste
Description
Burnley助焊膏适用于手机PCB,BGA及PGA等SMD之返修助焊膏,它使用于低离子性之活化剂系统,润锡速度快,冒烟程度很低,残留物固化后之表面绝缘阻抗值很高,因此,对手机等通讯产品之电性干扰非常小 DM-200为中度活性之松香型助焊膏,广泛使用手机板之SMD返修工艺
适合南北桥,显卡,手机芯片,电玩BGA芯片焊接,植球,也可做脱锡使用,效果非常理想,残留物少、焊点亮、烟雾少、无刺激气味、不跑球