Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting
Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting
Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting
Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting
Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting

Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting

5.0
93 sold.
Minimum quantity is: 1 pcs

Price from:

75,233 so'm

Guaranteed delivery time

If we are 45 days late, you will receive your order for free. More details

Always in touch with you

We will answer any questions every day.

Secure payment in a convenient way

We will accept payment by any card

BNPL available

Uzum
select product
inTend
select product
Select payment by installments when placing your order. The final installment cost is calculated at checkout.
Wholesale BURNLEY BGA solder paste lead-free environmentally friendly solder paste DM-200-BU solder paste for ball planting

About the product

Characteristic

Origin

China

Operating temperature

300

Item No.

DM-200-BU

Type

Paste

Melting point

180℃

Scope of Application

Repair soldering paste for SMD such as PCB,BGA and PGA

Model

DM-200-BU

Viscosity

99

Type

Flux paste

Alloy component

None

Granularity

0.001

Cleaning angle

Welding spot peripheral

Activity

Neutral

Import or not

No

Customized processing

No

Order Number

DM-200-BU

Description

批发BURNLEY BGA助焊膏 无铅环保助焊膏DM-200-BU焊膏植球用

Burnley助焊膏适用于手机PCB,BGA及PGA等SMD之返修助焊膏,它使用于低离子性之活化剂系统,润锡速度快,冒烟程度很低,残留物固化后之表面绝缘阻抗值很高,因此,对手机等通讯产品之电性干扰非常小 DM-200为中度活性之松香型助焊膏,广泛使用手机板之SMD返修工艺

适合南北桥,显卡,手机芯片,电玩BGA芯片焊接,植球,也可做脱锡使用,效果非常理想,残留物少、焊点亮、烟雾少、无刺激气味、不跑球

产品应用:
适用于传感器、线材、马达、保险管、连接器、金属壳、灯饰、电子元器件、S M T维修、BGA芯片植球等
型号:DM-200
包装方式:100克每瓶
DM-200

DM-200

DM-200

DM-200

DM-200

DM-200
工厂直销

导购


Characters

Properties

Origin

China

Operating temperature

300

Item No.

DM-200-BU

Type

Paste

Description

批发BURNLEY BGA助焊膏 无铅环保助焊膏DM-200-BU焊膏植球用

Burnley助焊膏适用于手机PCB,BGA及PGA等SMD之返修助焊膏,它使用于低离子性之活化剂系统,润锡速度快,冒烟程度很低,残留物固化后之表面绝缘阻抗值很高,因此,对手机等通讯产品之电性干扰非常小 DM-200为中度活性之松香型助焊膏,广泛使用手机板之SMD返修工艺

适合南北桥,显卡,手机芯片,电玩BGA芯片焊接,植球,也可做脱锡使用,效果非常理想,残留物少、焊点亮、烟雾少、无刺激气味、不跑球

产品应用:
适用于传感器、线材、马达、保险管、连接器、金属壳、灯饰、电子元器件、S M T维修、BGA芯片植球等
型号:DM-200
包装方式:100克每瓶
DM-200

DM-200

DM-200

DM-200

DM-200

DM-200
工厂直销

导购


From this seller

View all