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Imported 3808 Substitute Low Halogen Epoxy Underfill for CSP (FBGA) and BGA
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UF3808
1,645,721 so'm
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Imported 3808 Substitute Low Halogen Epoxy Underfill for CSP (FBGA) and BGA
About the product
Characteristic
- Shelf life
6 months
- Origin
Guangdong
- Working temperature
80
- Shear strength
15
- Brand
Gulbon
- Validity period
6 months
- Effective substances ≥
100
- Classification of resin glue
Epoxy resin adhesive
- Adhesive material type
Glass
Plastic
Electronic components
Fibers
- Is it imported?
No
- Environmental protection level
Qualified products
- Curing method
Hot melt curing
- Country/region of origin
China
Description
UF3808 是一种单组份、低卤、高可靠性的环氧底部填充胶, 适用于 CSP (FBGA) 以及BGA。加热后可快速固化, 抗机械应力出色。低粘度, 常温流动性好, 在常温下即可充分填充CSP 和 BGA 的底部。
固化前特性
典型值范围
外观黑色液体
化学类型环氧树脂
密度(g/cm 3 )1.161.14-1.18
粘度(mPa.s)(Brookfield HB)
CP40, 20rpm360330-400
室温使用期（天@25℃）3
推荐固化条件
130℃固化8min或
150℃固化5min
固化速度的快慢，取决于加热设备的加热效率和被加热PCB板的厚度以及芯片大小。要根据加热设备和被粘接物体适当的调节固化温度和固化时间。
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Properties
- Shelf life
6 months
- Origin
Guangdong
- Working temperature
80
- Shear strength
15
Description
UF3808 是一种单组份、低卤、高可靠性的环氧底部填充胶, 适用于 CSP (FBGA) 以及BGA。加热后可快速固化, 抗机械应力出色。低粘度, 常温流动性好, 在常温下即可充分填充CSP 和 BGA 的底部。
固化前特性
典型值范围
外观黑色液体
化学类型环氧树脂
密度(g/cm 3 )1.161.14-1.18
粘度(mPa.s)(Brookfield HB)
CP40, 20rpm360330-400
室温使用期（天@25℃）3
推荐固化条件
130℃固化8min或
150℃固化5min
固化速度的快慢，取决于加热设备的加热效率和被加热PCB板的厚度以及芯片大小。要根据加热设备和被粘接物体适当的调节固化温度和固化时间。