New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator
New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator
New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator
New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator
New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator

New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator

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2974 sold.
Minimum quantity is: 2 pcs

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If we are 45 days late, you will receive your order for free. More details

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New hot plate mobile phone semiconductor refrigeration surface amplifier cooling composite hot plate suitable for mobile phone radiator

About the product

Characteristic

Material

Aluminum Sheet + silica gel

Origin

Guangdong

Product Size

60*106 * 1mm

Item No.

Heating plate

Interface Type

None

Connection method

Wireless

Model

Heating plate

Use objects

IPhone

Android phone

Product Weight

20g

Time to Market

2022

Applicable products

Smartphone

Product Type

Brand New

Additional features

Auxiliary semiconductor cooling surface amplification heat dissipation

Applicable Number

1 person

Invoice

Invoice Not provided

Vibration mode

No vibration

Video game grading

Entry level

Game Machine accessories type

Other game peripheral

Patent source or not

No

Packing List

Product + packaging

Description

  • Heat Dissipation Technology:This new heat dissipation plate employs a half-conduction cooling mechanism, effectively reducing the temperature of your smartphone and enhancing its cooling efficiency.
  • Universal Compatibility:Designed to be a versatile accessory, this heat dissipation plate is compatible with both Android and Apple smartphones, making it a must-have for all users.
  • Compact Design:With dimensions of 60*106*1mm, this compact heat dissipation plate won't add any significant bulk to your smartphone, ensuring comfortable usage.
  • Easy Installation:The product comes with a package containing the heat dissipation plate and its packaging, making installation a breeze and hassle-free.
  • Enhanced Gaming Experience:Ideal for gaming enthusiasts, this heat dissipation plate enhances the gaming experience by ensuring your device stays cool even during intense gaming sessions.
  • Durable Material:Crafted from durable materials, this heat dissipation plate is designed to withstand regular use, offering long-lasting performance and reliability.

Characters

Properties

Material

Aluminum Sheet + silica gel

Origin

Guangdong

Product Size

60*106 * 1mm

Item No.

Heating plate

Description

  • Heat Dissipation Technology:This new heat dissipation plate employs a half-conduction cooling mechanism, effectively reducing the temperature of your smartphone and enhancing its cooling efficiency.
  • Universal Compatibility:Designed to be a versatile accessory, this heat dissipation plate is compatible with both Android and Apple smartphones, making it a must-have for all users.
  • Compact Design:With dimensions of 60*106*1mm, this compact heat dissipation plate won't add any significant bulk to your smartphone, ensuring comfortable usage.
  • Easy Installation:The product comes with a package containing the heat dissipation plate and its packaging, making installation a breeze and hassle-free.
  • Enhanced Gaming Experience:Ideal for gaming enthusiasts, this heat dissipation plate enhances the gaming experience by ensuring your device stays cool even during intense gaming sessions.
  • Durable Material:Crafted from durable materials, this heat dissipation plate is designed to withstand regular use, offering long-lasting performance and reliability.

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