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Graphene Copper Foil Heat Sink Vest Back Cover Copper Foil Substrate Nano Carbon Sticker Notebook Chip Cooling Film
3.0
41000 sold.
Minimum quantity is: 2,000 pcs
Price section
Price from:
1,598 so'm
Specification model
Customization; customization
1,598 so'm594,300 available in stock
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If we are 45 days late, you will receive your order for free. More details
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Graphene Copper Foil Heat Sink Vest Back Cover Copper Foil Substrate Nano Carbon Sticker Notebook Chip Cooling Film
About the product
Characteristic
- Origin
Dongguan
- Long-term temperature resistance
120
- Short-term temperature resistance
80
- Thickness
0.02
- Item no
Lingnuo-005
- Substrate
Graphene copper foil
- Width
Customizable
- Brand
Lingnuo
- Scope of application
Widely
- Whether to import
No
- There are licensable private brands
Yes
Description
Characters
Properties
- Origin
Dongguan
- Long-term temperature resistance
120
- Short-term temperature resistance
80
- Thickness
0.02
Description