Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects
Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects
Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects
Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects
Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects

Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects

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Low Pressure Vacuum Plasma Plasma Cleaning Equipment for Chip Wafer Surface to Reduce the Rate of Virtual Soldering Defects

About the product

Characteristic

Place of origin

Shanghai

Product code

005

Brand

Maohong

Overall dimensions

450*560*1800mm

Weight

100

Package

Wooden box

Processing and customization

Is

Description

e76c237975aa27874c7269f8144119

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Characters

Properties

Place of origin

Shanghai

Product code

005

Brand

Maohong

Overall dimensions

450*560*1800mm

Description

e76c237975aa27874c7269f8144119

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