Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.
Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.
Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.
Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.
Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.

Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.

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Manufacturers develop and produce polishing pads, CMP gallium nitride chip polishing pads.

About the product

Characteristic

Material

Polyamide fiber

Brand

CMPPAD

Scope of application

Gallium nitride chip grinding and polishing

Model

SH-Q13-800

Description

氧化铝抛光布/抛光垫

 

 

产品用途:用于对LED半导体、砷化镓、氮化镓、滤光片、玻璃,蓝宝石,石英,硅片、金属材料等的精磨抛和粗中抛。

产品规格:可根据规格定做任意规格,可按照要求贴背胶或者不贴背胶。
此种抛光布抛光效果好,可适应各种材质的研磨和抛光,抛光后精度可达0.02,可至完美的镜面效果。各种抛光布,抛光垫,抛光皮的制作,经验丰富,质美价廉!

 

型号

厚度(mm) 

压缩比(%)

密度(g/cm3)

硬度(JIS-A)

槽距(mm)

   应用工序

SH-Q13-600

1.3

5.5

0.39

 82

 15

 粗中抛

SH-Q13-800

1.3

6.7

0.39

 88

 15

 粗中抛


详情_02.jpg

详情_03.jpg

Characters

Properties

Material

Polyamide fiber

Brand

CMPPAD

Scope of application

Gallium nitride chip grinding and polishing

Model

SH-Q13-800

Description

氧化铝抛光布/抛光垫

 

 

产品用途:用于对LED半导体、砷化镓、氮化镓、滤光片、玻璃,蓝宝石,石英,硅片、金属材料等的精磨抛和粗中抛。

产品规格:可根据规格定做任意规格,可按照要求贴背胶或者不贴背胶。
此种抛光布抛光效果好,可适应各种材质的研磨和抛光,抛光后精度可达0.02,可至完美的镜面效果。各种抛光布,抛光垫,抛光皮的制作,经验丰富,质美价廉!

 

型号

厚度(mm) 

压缩比(%)

密度(g/cm3)

硬度(JIS-A)

槽距(mm)

   应用工序

SH-Q13-600

1.3

5.5

0.39

 82

 15

 粗中抛

SH-Q13-800

1.3

6.7

0.39

 88

 15

 粗中抛


详情_02.jpg

详情_03.jpg

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